Cu-Ni-Si合金析出物对再结晶的影响(英文)  

Effect of precipitates on recrystallization of Cu-Ni-Si alloy

作　　者：涂明武[1] 王东锋[1] 

机构地区：[1]空军第一航空学院二系,河南信阳464000

出　　处：《材料热处理学报》2011年第4期47-51,共5页Transactions of Materials and Heat Treatment

基　　金：National Natural Science Foundation of China (50071026)

摘　　要：通过分析时效期间Cu-Ni-Si合金显微硬度、导电率以及微观组织的变化,研究了析出相和再结晶行为的相互作用。结果表明,时效初期析出相对随后的再结晶过程具有强烈阻碍作用。在450、550℃较低温度时效时,合金发生原位再结晶,析出相在其体积分数略微升高或不变的情况下发生粗化;导电率上升趋势为先快后慢并趋于稳定,因而其变化曲线上无峰值出现;显微硬度则由于时效后期析出颗粒粗化,析出强化效果降低而出现峰值。在750℃高温时效时,合金发生不连续再结晶,析出相则在体积分数略有降低的情况下发生粗化;导电率先快速上升后缓慢下降因而出现峰值;而显微硬度由于析出物迅速粗化而一开始就表现为持续下降。By analyzing the change of microhardness,electric conductivity and microstructure of Cu-Ni-Si alloy during aging,the interaction between precipitated phase and recrystallization was studied.Results show that precipitates phase in early aging stage can strongly prevent recrystallization.When aging at 450 ℃ and 550 ℃,recrystallization in site occurred,and precipitates phase grew with no significant change of its volume fraction.Electric conductivity monotonously increased and microhardness increased first to a maximum value and then decreased for the alloy with increasing aging time.When aging at 750 ℃,discontinuous recrystallization occurred,and precipitates phase with slightly decreasing of its volume fraction as aging time increased.However,a peak in curve of electric conductivity vs.aging time is observed and microhardness decreased continuously for the alloy with increase of aging time.

关 键 词：CU-NI-SI合金 析出 再结晶 显微硬度 导电率 

分 类 号：TG146.1[一般工业技术—材料科学与工程]