低成本高性能Sn-Ag-Cu无铅钎料的研究  

Research on low-cost and high-performance Sn-Ag-Cu lead-free solders

作　　者：陈胜 徐金华 马鑫 吴佳佳 

机构地区：[1]深圳市亿铖达工业有限公司,518101 [2]东莞市亿铖达焊锡制造有限公司,523500

出　　处：《焊接》2011年第3期49-53,70-71,共5页Welding & Joining

基　　金：广东省科技厅粤港招标项目(2008A092000007;2008A080403008)

摘　　要：系统研究了Sn-Ag-Cu无铅钎料合金在Ag含量为0.1%～1.0%范围内的熔程、焊接性、力学性能及溶铜性能;研究了添加微量元素P和Ni对合金的焊接性和溶铜量的影响。结果表明,低银合金的熔程在217～227℃之间,随Ag含量的增加熔程缩小;Sn-0.5Ag-0.7Cu合金具有最佳的综合性价比;向这种成分的合金中添加0.01%的P和0.02%的Ni时,合金具有较好的焊接性,溶铜率大幅降低。The melting range,solderability,mechanical properties and copper dissolution amount of lead-free low-silver solder with silver content between 0.1～1.0% were systematically studied.Trace amount of P and Ni elements were added into the solder to investigate the effect of these additions on the solderability and copper dissolution amount.Results show that the melting ranges of all solders are between 217～227 ℃.,moreover,gets tighter with the amount of silver being increased.The solder with the composition of Sn-0.5Ag-0.7Cu has the best comprehensive properties.When 0.02% of P and 0.02% of Ni are added into the Sn-0.5Ag-0.7Cu alloy,it shows a good solderability and significant reduced copper dissolution rate.

关 键 词：无铅钎料 低银 溶铜 焊接性 力学性能 

分 类 号：TG454[金属学及工艺—焊接]