Influence of pH,immersion time,and benzotriazole concentration on copper corrosion in citric acid based slurries  

作　　者：LU XiaoRen LU XinChun LUO JianBin 

机构地区：[1]State Key Laboratory ofTribology, Tsinghua University, Beijing 100084, China [2]School of Mechanical Engineering, Shenyang University of Technology, Shenyang 110870, China

出　　处：《Chinese Science Bulletin》2011年第11期1158-1164,共7页

基　　金：supported by the National Natural Science Foundation for the Distinguished Young Scholar (50825501);the National Natural Science Foundation of China(50775122);the International Science Cooperated Program of the Ministry of Science and Technology of China(2006DFA73350)

摘　　要：Copper corrosion in citric acid based slurries with or without benzotriazole (BTA) was investigated as a function of the slurry pH,immersion time and BTA concentration by static etching and electrochemical experiments.The chemical composition of the corroded surface was determined using X-ray photoelectron spectroscopy (XPS).The static etching rate of copper in a H2O2 +citric acid+BTA slurry was lower than that in a H2O2 +citric acid slurry at pH 4.4-8.When the pH of the slurry was >8 or <4.4,the results were reversed and the static etching rate of copper increased when BTA was added to the H2O2 +citric acid slurry.The inhibitory effect of BTA in the H2O2 +citric acid slurry at pH 6 increased with the increasing immersion time of the copper.The corrosion current density of copper gradually decreased with increasing BTA concentration in slurry.Copper corrosion in citric acid based slurries with or without benzotriazole （BTA） was investigated as a function of the slurry pH, immersion time and BTA concentration by static etching and electrochemical experiments. The chemical composition of the cor- roded surface was determined using X-ray photoelectron spectroscopy （XPS）. The static etching rate of copper in a H202＋citric acid＋BTA slurry was lower than that in a H202＋citric acid slurry at pH 4.4-8. When the pH of the slurry was 〉8 or 〈4.4, the re- suits were reversed and the static etching rate of copper increased when BTA was added to the H202＋citric acid slurry. The in- hibitory effect of BTA in the H202＋citric acid slurry at pH 6 increased with the increasing immersion time of the copper. The corrosion current density of copper gradually decreased with increasing BTA concentration in slurry.

关 键 词：泥浆浓度 浸泡时间 柠檬酸 pH值 铜腐蚀 苯并三氮唑 X射线光电子能谱 H202 

分 类 号：TG172[金属学及工艺—金属表面处理]