柯伐合金应力腐蚀与电镀层质量的关系研究  

The effect of the Electroless Plating Quality to the Stress-corrosion Fracture of Kovar Alloy

作　　者：高进[1] 

机构地区：[1]山东轻工业学院机电工程系,济南250100

出　　处：《表面技术》1999年第5期4-6,共3页Surface Technology

摘　　要：柯伐合金用来制作电子元件的外引线时常用镀层进行保护。但是这种外引线易发生应力腐蚀断裂。在镀层存在缺陷时,镀金、镀镍层均促进柯伐合金的应力腐蚀开裂。其断裂机理为氢致开裂。减少镀层缺陷可大大减少外引线的应力腐蚀断裂。The Kovar alloy used for the outlet of fixed circuit often is plated to preserve from corrosion. But the outlet of fixed circuit often is plated to preserve from corrosion. But the outlet of fixed circuit made of the alloy is ease to occur delay fracture. When the plating exist defect,the gold-plating nickel-plating both promote the stress-corrosion fracture of Kovar alloy. The reason of fracture is hydrogen brittleness. The reduce of plating defect will greatly reduce the stress-corrosion fracture of the outlet.

关 键 词：柯伐合金 电镀 电子元件 应力腐蚀 镀层 质量 

分 类 号：TQ153.2[化学工程—电化学工业] TN605[电子电信—电路与系统]