玻璃表面改性的XPS研究  

XPS Study of the Glass Surface Modification

作　　者：郑兆佳[1] 胡缙昌[1] 

机构地区：[1]武汉工业大学材料研究与测试中心,武汉430070

出　　处：《表面技术》1999年第5期7-8,共2页Surface Technology

摘　　要：用硅烷对B-1E型玻璃封接的电子器件管座表面进行了处理改性,大大提高了玻璃表面的电气绝缘性能。本文用X射线光电子能谱(XPS)分析研究了玻璃表面Si2p和Ols电子结合能在硅烷作用前后的变化,指出这一相互作用是一种化学过程。作者还提出了硅烷与玻璃表面化学键合的理想模型。A surface modification has been made by silane for the electronic device base sealed by B-1E glass. The electric insulation performance of the glass surface is well improved. Using X-ray photoelectron spectroscopy(XPS) and comparing the changes of the binding energies of Si2p and 01s on the glass surface before and after the treatment by silane, the authors conclude that this interaction is a chemical process and give an ideal model for the chemical bonding of silane with the glass surface.

关 键 词：玻璃 硅烷 X射线 光电子能谱 表面改性 电子器件 

分 类 号：TN605[电子电信—电路与系统]