Mechanism of brittle-ductile transition of a glass-ceramic rigid substrate  

作　　者：Yu-li Sun Dun-wen Zuo Hong-yu Wang Yong-wei Zhu Jun Li 

机构地区：[1]Jiangsu Key Laboratory of Precision and Micro-manufacturing Technology, College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China

出　　处：《International Journal of Minerals,Metallurgy and Materials》2011年第2期229-233,共5页矿物冶金与材料学报（英文版）

基　　金：supported by the National Natural Science Foundation of China (No.50905086);China Postdoctoral Science Foundation (No.200904501095);Jiangsu Planned Projects for Postdoctoral Research Funds (No.0901035C);NUAA Research Funding (No.NS2010134)

摘　　要：The hardness, elastic modulus, and scratch resistance of a glass-ceramic rigid substrate were measured by nanoindentation and nanoscratch, and the fracture toughness was measured by indentation using a Vickers indenter. The results show that the hardness and elastic modulus at a peak indentation depth of 200 nm are 9.04 and 94.70 GPa, respectively. These values reflect the properties of the glass-ceramic rigid substrate. The fracture toughness value of the glass-ceramic rigid substrate is 2.63 MPa？m1/2. The material removal mechanisms are seen to be directly related to normal force on the tip. The critical load and scratch depth estimated from the scratch depth profile after scratching and the friction profile are 268.60 mN and 335.10 nm, respectively. If the load and scratch depth are under the critical values, the glass-ceramic rigid substrate will undergo plastic flow rather than fracture. The formula of critical depth of cut described by Bifnao et al. is modified based on the difference of critical scratch depthThe hardness, elastic modulus, and scratch resistance of a glass-ceramic rigid substrate were measured by nanoindentation and nanoscratch, and the fracture toughness was measured by indentation using a Vickers indenter. The results show that the hardness and elastic modulus at a peak indentation depth of 200 nm are 9.04 and 94.70 GPa, respectively. These values reflect the properties of the glass-ceramic rigid substrate. The fracture toughness value of the glass-ceramic rigid substrate is 2.63 MPa？m1/2. The material removal mechanisms are seen to be directly related to normal force on the tip. The critical load and scratch depth estimated from the scratch depth profile after scratching and the friction profile are 268.60 mN and 335.10 nm, respectively. If the load and scratch depth are under the critical values, the glass-ceramic rigid substrate will undergo plastic flow rather than fracture. The formula of critical depth of cut described by Bifnao et al. is modified based on the difference of critical scratch depth

关 键 词：brittle-ductile transition critical conditions glass ceramics NANOINDENTATION NANOSCRATCH 

分 类 号：TP333.3[自动化与计算机技术—计算机系统结构] TN405.94[自动化与计算机技术—计算机科学与技术]