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作 者:许宁[1] 关琦[1] 杨小燕[1] 伍凯飞[1] 杨玉明
机构地区:[1]南京化工职业技术学院,江苏南京210048 [2]南京湘宝钛白制品实业有限公司,江苏南京211301
出 处:《中国新技术新产品》2011年第10期3-4,共2页New Technology & New Products of China
摘 要:本文简要介绍了脲醛树脂基高分子材料的基本生产工艺流程,探索玻璃纤维、纳米蒙脱土、丁腈橡胶粉以及玉米淀粉种类和用量对脲醛树脂基高分子材料耐电击穿性能的影响。实验结果表明,选用玻璃纤维作为增强剂对脲醛树脂基高分子材料的耐电击穿强度影响最为明显,纳米蒙脱土次之,玉米淀粉的加入对脲醛树脂基高分子材料的耐电击穿强度影响不明显,而丁腈橡胶的加入对脲醛树脂基高分子材料的耐电击穿强度有明显的下降趋势,改性后的脲醛树脂基高分子材料的耐电击穿强度能超过17KV/mm,最佳耐压时间在100s以上。In this article the basic production process of the urea-formaldehyde resin polymer materials was briefly introduced,and the influence of the fiberglas,nanometer montmorillonite,butyronitrile rubber powder,category and amount of cornstarch were explored.The result showed that the influence of fiberglas was the greatest when it's as intensifier.The influence of nanometer montmorillonite was greater,and the influence of cornstarch was small to the intensity of anti-electrical Breakdown Strength.When butyronitrile rubber were added,the intensity of anti-electrical Breakdown Strength was obviously decline.The intensity of anti-electrical Breakdown Strength exceeded 17KV/mm after reshaping.The best withstand voltage time was above 100s.
关 键 词:脲醛树脂基高分子材料 改性 耐电击穿强度
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