十二烷基硫酸钠和1.4-丁炔二醇电沉积Ni-W合金的机理  

Mechanism of sodium lauryl sulfate and 1.4-butynediol in electrodepositing Ni–W alloys

作　　者：彭超[1] 殷志伟[1] 汪晓[1] 刘阳[1] 陈颢[2] 张雪辉[2] 

机构地区：[1]湖南有色中央研究院,长沙410200 [2]江西理工大学材料与化学工程学院,赣州341000

出　　处：《粉末冶金材料科学与工程》2011年第2期167-174,共8页Materials Science and Engineering of Powder Metallurgy

基　　金：湖南有色中央研究院专项资金资助项目

摘　　要：通过络合理论、晶粒特征、表面形貌、微观结构和费卢姆金(Φpymknh)方程式,研究十二烷基硫酸钠(SLS)和1.4丁炔二醇(BOZ)2种表面活性剂对Ni-W合金电镀及镀层质量的影响,考察针对性阻化作用机理和镀层硬度下降的原因。结果表明:SLS为0.2 g/L、BOZ为0.4 g/L时,表面活性剂达到形成胶束的临界浓度CMC,表面活性剂的阻化作用最为显著,电镀速度明显减小,但晶粒细化,表面变光整,耐蚀性能显著提高,年腐蚀速率Ke仅为0.0025 mm/y,耐蚀等级为2;在电镀过程中,SLS对钨有针对性阻化作用,随SLS浓度的增加,镀层中的钨明显减少,硬度降低;少量SLS可有效防止气泡、针孔,但当浓度达到0.4 g/L时,沉积层错层明显,镀层表面变得粗糙,然而加入BOZ可有效消除错层以及镀层缝隙,当SLS为0.2 g/L、BOZ为0.4 g/L时镀层表面非常平滑。The effects of sodium lauryl sulfate（SLS） and 1.4-butynediol（BOZ） on Ni-W electro-deposition,electrodepositing layer quality,targeted inhibition,hardness and corrosion were investigated by complex theory,grain characterization,surface morphology,microstructure and ΦPYMKNH equation.The inhibition mechanism and the cause of hardness decreasing were explored in the present paper.The results show that,when SLS is 0.2 g/L and BOZ is 0.4 g/L,surfactant reaches the critical micelle concentration（CMC）,inhibition becomes obvious and the depositing velocity drops quickly.Meanwhile,the Ni-W electrodepositing layers show refine grain and its surface becomes smoother.In addition,corrosion resistance is improved significantly with year corrosion rate（Ke） of 0.0025 mm/y and corrosion resistance of class 2.During the electrodepositing,SLS shows a significant inhibition to tungsten,meaning that tungsten content in the electrodepositing layer and the hardness of the electrodepositing layer decrease with increasing SLS concentration.Small amount of SLS can prevent pinholes and bubbles,while the electroplated layers are dislocated obviously and its surface becomes rough when SLS is 0.4 g/L.However,the dislocated layers and cracks can be removed by adding BOZ.Extraordinary smooth coating is obtained with SLS of 0.2 g/L and BOZ of 0.4 g/L.

关 键 词：表面活性剂 电镀 镍钨合金 阴极极化 耐腐蚀 晶粒畸变 

分 类 号：TQ153[化学工程—电化学工业]