三元催化器薄壁涂覆载体导入式封装工艺研究  

Introduction Packaging Technique of Three-way Catalytic Converter with Thin-walled Coating Carrier

作　　者：江洪[1] 赵计平[1] 

机构地区：[1]重庆工业职业技术学院,重庆401120

出　　处：《重庆科技学院学报（自然科学版）》2011年第2期111-112,共2页Journal of Chongqing University of Science and Technology：Natural Sciences Edition

摘　　要：目前国内生产企业所采用的压入式封装工艺极易造成涂覆载体装配裂纹。为此提出了一种新的薄壁涂覆载体导入式封装工艺,并对封装原理、封装过程进行了应力分析。经生产验证,该工艺有效地减少了薄壁涂覆载体封装裂纹。At present,the indentation packaging technique adapted by domestic companies is easy to makes assembling cracks for coating carrier.So the paper proposes a new introduction packaging technique for thin-walled coating carrier.The production shows that the technique shall reduce assembling cracks effectively.

关 键 词：三元催化器 薄壁涂覆载体 导入式封装工艺 压入式封装工艺 

分 类 号：TH162[机械工程—机械制造及自动化]