胶粘光学元件的热应力和变形分析  

Thermal stress and deformation analysis of bonded optics

作　　者：范志刚[1] 常虹[1] 陈守谦[1] 

机构地区：[1]哈尔滨工业大学空间光学工程研究中心,哈尔滨150001

出　　处：《光学技术》2011年第3期366-369,共4页Optical Technique

摘　　要：由于光学元件和装配材料热膨胀系数的不匹配,在环境温度变化时会导致光学元件中产生热应力,并引起光学元件表面产生变形,影响光学系统的性能。针对光学元件的粘接固定方式讨论了连续边缘粘接引起的热应力和变形的分析方程,得出连续边缘粘接无热厚度的解析方程。采用有限元分析软件对胶粘固定光学元件进行了建模和热应力分析,得出光学元件边界处的热应力的数值解,并与方程计算的解析结果进行了比较。对比计算和分析结果表明:简单的解析解可以很好地评估热应力和变形;采用合理的粘接厚度可以消除或最小化光学元件径向热应力,实现光学元件装配的无热设计。The mismatch of thermal expansion coefficient between optics and mount can bring thermal stress on the optics,and induces surface deformation of optics.Therefore,the thermal effects should be considered when mounting optics.The analytical equations of thermal stress and deformation caused by continuous edge elastomeric bond are discussed.Analytical equations for the athermalized edge bond thickness are derived,and verified by finite-element solutions.The comparison shows that simple analytical solutions can provide good estimations for thermal stresses and deformations;the radial thermal stress can be minimized or removed by reasonable bond thickness,the athermal design of optics mounting is performed.

关 键 词：热应力 热变形 胶粘接 无热设计 

分 类 号：TH761.6[机械工程—仪器科学与技术]