基于Moldflow软件的手机外壳流道平衡优化设计  

Design of Balance Optimization for Shell Runner of the Mobile Phone Based on Moldflow Software

作　　者：谢玉敏[1] 张汪年[1] 刘长华[1] 孙国栋[1] 

机构地区：[1]九江学院机械与材料工程学院,江西九江332005

出　　处：《塑料工业》2011年第5期54-56,共3页China Plastics Industry

摘　　要：针对手机外壳上下盖异模多型腔的流道不平衡问题,利用Moldflow软件的Runner Balance模块进行了优化。结果表明:优化后手机下盖末端充满时间为0.885 8 s,手机上盖末端的充满时间为0.858 8 s,不平衡率控制在3.1%,流动平衡性较好。流道尺寸由初始设计的应嫡3 mm,优化为平衡时的Φ3.739 mm和Φ1.666 mm。V/P转换点的浇口位置压力为29.85 MPa,接近约束条件中的目标压力30 MPa,上下盖型腔内的压力分布比较均匀。The runner balance of mobile telephone was optimized in view of the runner imbalance of different mould multi-cavity in the design of plastic injection mold by means of Moldflow software. The results showed that the fill time of the back cover of mobile telephone was 0. 885 8 s and the upper cover of mobile telephone was 0. 858 8 s, the imbalance rate was 3.1%, the flow balance was good. The optimized runner size was ψ3.739 mm andψ1. 666 mm while the runner size wasψ3 mm before optimization. The gate location of V/P transformation point was 29.85 Mpa and was close to the target pressure 30 Mpa, the distribution of pressure in upper and back cavities was even.

关 键 词：MOLDFLOW 手机外壳 流道平衡 V/P转换点 

分 类 号：TQ320.662[化学工程—合成树脂塑料工业]