直流电弧等离子体蒸发法制备超细铜粉研究  

Study on the Preparation of Ultrafine Copper Powders by DC Arc Plasma Evaporation Method

作　　者：陈西[1] 张振忠[1] 赵芳霞[1] 王鹏[1] 

机构地区：[1]南京工业大学材料科学与工程学院,江苏南京210009

出　　处：《铸造技术》2011年第4期527-530,共4页Foundry Technology

基　　金：江苏省科技厅社会发展计划(BS2007120);国家中小型企业创新基金项目(08026213700982)资助

摘　　要：采用自行研制的高真空三枪直流电弧等离子体蒸发连续制粉设备制备了高纯度超细铜粉。系统研究了电流强度、氢氩比、充气压力3个工艺参数对超细铜粉产率和平均粒径的影响。利用X射线衍射(XRD)、X射线荧光分析(XRF)、透射电子显微镜(TEM)和相应的选区电子衍射(SAED)以及Simple PCI软件等测试手段,对样品的晶体结构、成分、形貌和粒径分布进行表征。研究结果表明,该设备制备的超细铜粉纯度高达99.949%,粒径分布窄,分散性好,颗粒主要呈球状,平均粒径在52.7～159.1 nm范围内,为多晶结构;阴极电流强度和氢氩比分别是影响超细铜粉产率及平均粒径的最主要影响因素,阴极电流强度从500 A增加到700 A时,产率提高了173.8%;最大产率比同类研究结果提高了近20%。Various ultrafine copper powders were prepared by self-designed fabricated high-vacuum three-electrode DC arc plasma production apparatus.Effects of technical parameters（current,P（H2）/P（Ar） ratio,and pressure） on productivity and average diameters were studied by orthogonal test.The crystalline structure,chemical composition,morphology,and particle size distribution of the samples were characterized by X-ray diffraction（XRD）,X-ray fluorescence analysis（XRF）,transmission electron microscopy（TEM）,selected area electron diffraction（SAED） and simple PCI software.The results indicate that the prepared ultrafine copper powders have uniform size,high purity of 99.949%,narrow size distribution,spherical mainly,polygonal crystal,and the average diameters is in the range from 52.7 nm to 159.1 nm.The current and P（H2）/P（Ar） ratio are the significant factors to affect productivity and average diameters respectively.The productivity of ultrafine copper powders increase 173.8% when the cathode current is from 500 A to 700 A.The maximum productivity is increased nearly 20% compared with that of similar research.

关 键 词：超细铜粉 直流电弧等离子体蒸发 微观结构 制备 

分 类 号：TF123.23[冶金工程—粉末冶金]