光谱成像用红外焦平面读出电路研究  

Study on Readout Circuit of SWIR FPA for Spectral Imaging Application

作　　者：张伟[1,2] 黄张成[1,2] 黄松垒[1,2] 方家熊[1] 

机构地区：[1]中国科学院上海技术物理所传感器技术国家重点实验室,上海200083 [2]中国科学院研究生院,北京100039

出　　处：《半导体光电》2011年第2期272-275,共4页Semiconductor Optoelectronics

摘　　要：红外焦平面是光谱成像系统的核心器件。讨论了多光谱用红外焦平面读出电路的特点,设计了用于多光谱成像的64×16元红外焦平面读出电路。读出电路采用CTIA输入级,快照式曝光方式,边积分边读出工作。电路芯片与InGaAs光敏芯片阵列通过铟柱倒焊的方法,组成混成互连焦平面器件,像元间距50μm,响应波段0.9～1.7μm,盲元率0.2%,半阱时的响应不均匀性4.7%。The Focal plane array is one of the most important parts of spectral imaging system.The characters of the readout circuit for spectral imaging technology was discussed and a 64×16 readout circuit was designed.The circuit applies CTIA input stage and snapshot exposure,so it can integrate while read mode.The hybrid InGaAs FPA is constituted by the readout circuit and InGaAs detector,and its pitch is 50 μm,spectral range of 0.9~1.7 μm,and the response non-uniformity is 4.7% at half of well.

关 键 词：光谱成像技术 混成式短波红外焦平面 快照式读出电路 背照InGaAs探测器 

分 类 号：TN214[电子电信—物理电子学]