高温高压下新型金刚石/碳化硅热沉材料的热导率研究  

Study on the thermal conductivity of HTHP diamond/SiC ceramic heat sink material

作　　者：武琪[1] 彭放[1] 李庆华[1] 张文凯[1] 管俊伟[1] 寇自力[1] 

机构地区：[1]四川大学原子与分子物理研究所,成都610065

出　　处：《金刚石与磨料磨具工程》2011年第2期40-43,共4页Diamond & Abrasives Engineering

摘　　要：本文针对国内外对高导热、低热膨胀系数的热沉材料需求,以金刚石为基体、硅粉为添加物,用国产六面顶压机在5.1 GPa,1 350~1650℃的条件下,采用高压固液渗透法合成出金刚石/碳化硅陶瓷热沉材料,并对高压烧结体的相组成、密度与热导率进行了分析。研究结果表明：初始材料中硅含量、烧结时间与温度对烧结体的成分以及密度有很大影响;当压力为5.1 GPa、烧结温度1450℃、烧结时间180 s时,烧结体热导率达到650 W/（m.K）,在初始材料加入少量钴后,烧结体的热导率最高达到700 W/（m.K）。In this paper,the diamond/ SiC ceramic heat sink material is synthesized in a cubic press by high temperature solid-liquid osmosis method under the condition of 5.1 GPa,1 350~1 650 ℃.The analysis of the phase composition,density and thermal conductivity of high-pressure compact was conducted.The results indicated that the silicon content,sintering time and temperature had a great effect on the composition and density of the compact.It was found that when the sintering pressure,temperature and time were 5.1 GPa,1 450 ℃ and 180 s,the thermal conductivity reached 650 W/（m·K）.If Co were added to the starting material,the thermal conductivity would reach up to 700 W/（m·K）.

关 键 词：金刚石/碳化硅烧结体 高温高压 热导率 

分 类 号：TG74[金属学及工艺—刀具与模具] TG713