球磨时间对硼硅玻璃基复相陶瓷性能的影响  

Effects of grinding time on properties of borosilicate glass composite ceramics

作　　者：王杰[1] 周洪庆[1] 韦鹏飞[1] 张一源[1] 曾凤[1] 

机构地区：[1]南京工业大学材料科学与工程学院,江苏南京210009

出　　处：《电子元件与材料》2011年第6期5-8,共4页Electronic Components And Materials

基　　金：国家"863"计划资助项目(No.2007AA03Z0455)

摘　　要：采用经过不同球磨时间制备的硼硅玻璃与氧化铝复合,低温烧结制备了硼硅玻璃/氧化铝系复相陶瓷。利用XRD和SEM,研究了硼硅玻璃粉料球磨时间对流延成型及所制复相陶瓷的烧结性能、介电性能(10 MHz)的影响。结果表明:随着球磨时间增加,粉料粒径减小,硼硅玻璃复相陶瓷烧结温度降低,密度增加,介电常数和介质损耗降低。球磨90 min在850℃烧结的试样性能较佳:密度为3.22 g.cm–3,10 MHz下的相对介电常数和介质损耗分别为7.92和1.2×10–4。Low-temperature sintering borosilicate glass composite ceramics were prepared by the borosilicate glass powders with different grinding time and alumina powders.The effects of grinding time on the tape casting,sintering properties and dielectric properties（at 10 MHz） of prepared composite ceramic were investigated by XRD and SEM.The results show that the particle sizes,sintering temperature,permittivity and dielectric loss all decrease,while the density increases,as the grinding time increases.The sample grinded for 90 min and sintered at 850 ℃ possess better properties： a density of about 3.22 g·cm–3,a relative permittivity of 7.92 and a dielectric loss of 1.2×10–4 at 10 MHz.

关 键 词：硼硅玻璃 球磨时间 性能 

分 类 号：TM28[一般工业技术—材料科学与工程]