陶瓷表面化学镀Ni-P合金工艺的研究  

Research on Electroless Ni-P Alloy Plating on Ceramics Surface

作　　者：李丽波[1] 李东平[1] 张书华[1] 赵春山[1] 李佳[1] 杨照地[1] 李晓霞[1] 谢菁琛[1] 国绍文[2] 

机构地区：[1]哈尔滨理工大学化学与环境工程学院,黑龙江哈尔滨150040 [2]黑龙江工程学院机电控制及自动化系,黑龙江哈尔滨150050

出　　处：《电镀与环保》2011年第3期19-21,共3页Electroplating & Pollution Control

基　　金：黑龙江省教育厅科学技术研究项目(11521041)

摘　　要：陶瓷表面经化学镀镍处理后既可以保证陶瓷原有的机械物理性能,又可以使陶瓷具有导电、导热、耐蚀等性能。采用正交实验的方法,得出陶瓷表面化学镀镍的最佳工艺配方和条件。采用扫描电子显微镜观察镀层微观形貌,利用能谱仪分析其化学成分,通过热震实验测试镀层与陶瓷的结合力。结果表明:陶瓷表面镀层覆盖完整、均匀、致密,镀层与陶瓷结合良好,镀层中P的质量分数为13.46%,Ni的质量分数86.54%。Electroless Ni-P plating on ceramics surface can not only ensure the original mechanical physical properties, but also achieve a conductive ceramic, thermal conductivity, corrosion resistance as well as the other performance. The researches on electroless Ni-P alloy plating on the ceramics surface and obtains the optimum formula and technology conditions by the orthogonal experiment method. The morphology of the coatings is observed by SEM, the components are analyzed by EDAX, and the adhesion of the coatings and the ceramic is determined by thermal shock method. The results show that the Ni-P coatings obtained under the optimum conditions are uniform, continuous and adhered to the ceramics. The content of P is 13.46 %and the content of Ni is 86.54% in the deposition.

关 键 词：化学镀Ni—P合金 陶瓷 覆盖度 结合力 

分 类 号：TQ153[化学工程—电化学工业]