真空扩散焊对镁合金电极性能的影响  

Effect of vacuum diffusion bonding on electrochemical performance of magnesium alloy electrode

作　　者：周威[1] 殷立勇[1] 黄锐妮[1] 李林[1] 王宇轩[1] 

机构地区：[1]中国电子科技集团公司第十八研究所,天津300381

出　　处：《电源技术》2011年第5期537-539,共3页Chinese Journal of Power Sources

摘　　要：研究了真空扩散焊对镁合金电极性能的影响。运用扫描电镜(SEM)对镁合金电极进行了形貌分析,通过极化曲线研究了镁合金电极在NaCl溶液中的电化学活性,并对样品进行了电性能测试。实验结果表明:经过真空扩散焊处理后,尽管镁合金电极自腐蚀速率加快,但镁合金电极的电性能得到显著提高。The influence ofvacuum diffusion bonding on magnesium alloy electrodes was studied.The morphologies magnesium alloy electrodes were characterized by scanning electron microscopy.The electrochem icalactivity of the magnesium alloy electrodes were studied in NaC lsolution by polarization curves and the electric tests were carried out.The results indicate that the electrochem icalperform ance of magnesium alloy electrodes is improved markedly aftervacuum diffusion bonding though the self-corruptspeed of electrodes is accelerated.

关 键 词：真空扩散焊 镁合金电极 电化学活性 电性能 

分 类 号：TM924[电气工程—电力电子与电力传动]