选择性无电解镀铜在PET膜表面上构筑微铜图案  

Fabrication of Copper Patterns on PET Films by Selective Electroless Copper Plating

作　　者：杨军[1] 吴仲岿[1] 李少英[1] 唐红肖[1] 叶立刚[1] 

机构地区：[1]武汉理工大学材料科学与工程学院,武汉430070

出　　处：《表面技术》2011年第3期26-28,43,共4页Surface Technology

基　　金：国家自然科学基资助项目(50973087/E0310);中央高校基本科研业务费专项资金资助

摘　　要：采用波长为172nm的紫外光使PET膜表面官能化,然后自组装APTES单分子膜(SAMs),再在真空条件下通过紫外光刻蚀对PET膜表面的SAMs进行微加工,最后进行选择性无电解镀铜处理。通过测量水接触角和XPS分析,表征了PET膜经各步处理后的表面状态,并观察了镀铜后的微铜图案。结果表明:紫外光照使PET基材表面改性,通过紫外光刻蚀技术,对SAMs的微加工可以控制铜在PET表面选择性沉积,从而一次性制备出保真性较好的微米级镀铜图案。PET surface was modified by ultraviolet lithography at a wavelength of 172 nm. Then, the SAMs which self-assembled on PET surface was etched by vacuum ultraviolet lithography. Finally, the films served as the template for the selective electroless deposition of copper structures. To confirm the chemical composition and the mor- phology of the patterned flims, water contact angle and X-ray photoelectron spectroscopy（ XPS） were performed on sam ples in each step. Micron copper patterns were observed also. The results show that VUV can be used to modify PET surface and the SAMs successfully deposit on the modified PET films. The SAMs microfabricated by VUV etching tech- nology is suitable for subsequent selective electroless copper plating processing. Finally, micron copper patterns with high-fidelity are successfully prepared on PET via one step manufacture.

关 键 词：PET膜 图案化 选择性镀铜 真空紫外光刻蚀 无电解镀 SAMS 

分 类 号：TQ153.14[化学工程—电化学工业]