热障涂层热不匹配残余应力的分析研究  

Analysis of Residual Stresses in Thermal Barrier Coating due to Thermal Mismatch

作　　者：白玉梅[1] 徐颖强[1] 赖明荣[2] 张涛[1] 

机构地区：[1]西北工业大学机电学院,西安710072 [2]太原理工大学机械工程学院,太原030024

出　　处：《科学技术与工程》2011年第14期3126-3129,共4页Science Technology and Engineering

基　　金：国家自然科学基金项目(50875214)和(11072196)资助

摘　　要：广泛应用于高温部件的热障涂层,在热载荷作用下各层间所集聚的残余应力是导致其层裂和失效的重要原因。针对热障涂层由于热不匹配产生的残余应力,建立了相应的平面应变模型,研究了温度与涂层厚度对界面残余应力和陶瓷层内最大残余应力分布的影响。结果表明,陶瓷层内的残余应力主要表现为横向压缩应力,且最大值位于距陶瓷层表面1/3厚度处;界面残余应力相对较小,但在自由边界处有应力集中现象;随着温度的升高应力值在增大,陶瓷层厚度增加会改变结构厚度方向上的应力分布,且厚度增加使陶瓷层内残余应力值和界面残余应力值减小。Thermal barrier coating（TBC） has been used widely in heat components,the residual stress concentrated by thermal load can lead to spalling or failure for the entire coating system.A plane strain geometrical model of thermal barrier coating（TBC） is established in order to investigate the effects of temperature and ceramic thickness on the distributed characters of maximal residual stresses in ceramic and interfacial ones.The results show that the stress in ceramic layer is mainly for lateral compressive one,and its maximal stress occurs in the place that is at the distance of 1/3 thickness from coating surface;The interracial stresses are comparatively feeble,but concentrate at the free edge.And that the increase of temperature makes stresses to rise.Increase of coating＇s thickness changes the distribution of stresses in the direction of thickness and makes residual stresses and interfacial stresses reduction.

关 键 词：热障涂层 残余应力 界面应力 

分 类 号：O343.6[理学—固体力学]