Sn3.8Ag0.7Cu和Sn37Pb焊点界面显微结构研究  

Interfacial microstructures of Sn3.8Ag0.7Cu and Sn37Pb joints

作　　者：刘平[1,2] 姚琲[3] 顾小龙 赵新兵[2] 刘晓刚 

机构地区：[1]浙江省冶金研究院有限公司浙江省钎焊材料与技术重点实验室,浙江杭州310011 [2]浙江大学材料科学与工程学系,浙江杭州310027 [3]天津大学材料科学与工程学院,天津300072

出　　处：《电子显微学报》2011年第2期102-107,共6页Journal of Chinese Electron Microscopy Society

基　　金：浙江省自然科学基金资助项目(No.Y4100809)

摘　　要：利用扫描电子显微镜(SEM)和透射电子显微镜(TEM)研究了Sn3.8Ag0.7Cu(Sn37Pb)/Cu焊点在时效过程中的界面金属间化合物(IMC)形貌和成份。结果表明:150℃高温时效50、100、200、500h后,Sn3.8Ag0.7Cu(Sn37Pb)/Cu焊点界面IMC尺寸和厚度增加明显,IMC颗粒间的沟槽越来越小。50h时效后界面出现双层IMC结构,靠近焊料的上层为Cu6Sn5,邻近基板的下层为Cu3Sn。之后利用透射电镜观察了Sn37Pb/Ni和Sn3.8Ag0.7Cu/Ni样品焊点界面,结果显示,焊点界面清晰,IMC晶粒明显。The present work studied the IMC morphology and composition at the interface of aged Sn3.8Ag0.7Cu（Sn37Pb）/Cu joints by SEM and TEM.It was found that IMC layer thickness and grain size increased with the increase of aging time.After 50 h aging,Sn3.8Ag0.7Cu（Sn37Pb） /Cu joints exhibited a duplex intermetallic compound structure;i.e.a layer of Cu6 Sn5 close to the solder and a layer of Cu3 Sn adjacent to the Cu substrate.Finally the interface of FIB prepared Sn37Pb/Ni and Sn3.8Ag0.7Cu/Ni sample was examined under TEM.TEM images showed that the interfacial structure and IMC grain were evident.

关 键 词：Sn3.8Ag0.7Cu Sn37Pb 金属间化合物 扫描电镜(SEM) 透射电镜(TEM) 

分 类 号：TG401[金属学及工艺—焊接]