托盘在混装电路板波峰焊接的应用  

Application of Pallet in Wave Soldering for Mix-assembled Circuit Board

作　　者：吴建生 

机构地区：[1]厦门华侨电子有限公司,福建厦门361006

出　　处：《电子工艺技术》2011年第3期145-147,184,共4页Electronics Process Technology

摘　　要：随着表面贴装技术工艺的日趋成熟,对波峰焊托盘在混装电路板组装的应用要求也越来越高,托盘的使用也带来一些工艺问题,通过对托盘的选材及其应用的介绍,力求从托盘加工制作和PCB设计要求等方面提出解决方案,做出量化管理与控制,以提高波峰焊接质量,推进波峰托盘在电子产品组装焊接中的应用。With the maturity of SMT（Surface Mount Technology） day by day,the application and performance requirement of wave solder pallet is higher in mix assembly and some problems of wave soldering technology are brought.Introduce the application and material selection of pallet.Put forward the solutions from manufacture process of pallet and requirements of PCB Designs.Improve quality of wave soldering by enhancing quantitative management and control.

关 键 词：波峰焊 托盘 工艺设计 

分 类 号：TN705[电子电信—电路与系统]