双粒度配比钨粉对W-10Cu复合材料致密化、组织与性能的影响  

Influences of proportion of dual particle size on densification,microstructure and properties of W-10Cu composite material

作　　者：范景莲[1] 张骁[1] 游峰[1] 田家敏[1] 

机构地区：[1]中南大学粉末冶金国家重点实验室,湖南长沙410083

出　　处：《中南大学学报（自然科学版）》2011年第5期1238-1242,共5页Journal of Central South University:Science and Technology

基　　金：国家自然科学基金资助项目(50674106);国家杰出青年科学基金资助项目(50925416);国家自然科学基金创新群体资助项目(50721003)

摘　　要：在粒径为0.5,2.5,7.5和24μm的钨粉中,按粒径比3-1,5-1,10-1和15-1分别选取2种粒径进行配比,粗颗粒与细颗粒的质量比均为3-1,然后将不同配比的钨粉压制成钨骨架渗铜,获得W-10Cu复合材料,研究不同粒径配比对材料的密度、硬度、电导率等性能及其显微组织的影响。研究结果表明:随着粒径比的增加,材料的密度、硬度和电导率也随之提高;当粒径配比为10-1和15-1时,熔渗W-10Cu材料的致密度达到98.9%以上,其电导率达到23.8 S/m以上,钨颗粒之间相互黏结,产生了明显的烧结颈。Four kinds of tungsten powders with various particle sizes of 0.5, 2.5, 7.5 and 24 pm were used to compose four sorts of mixed tungsten powders, which have two particle sizes and their ratios are 3：l, 5：1, 10：1 and 15：1. In all the cases, the mass ratio of coarse particle component to fine particle one is 3：1. These mixed tungsten powders were then pressed into tungsten skeleton, followed by copper infiltration to fabricate W-10Cu composite. The effects of the particle size ratio on the properties of sintcring density, hardness, conductivity and microstructure of the composite were investigated. The results show that the sintering density, hardness and conductivity of the W-10Cu composite increase when the particle size ratio increases from 3：1 to 15：1. In the cases of the particle size ratios of 10：1 and 15：1, the relative density and the conductivity of the composite exceed 98.9% and 23.8 S/m, respectively, accompanied by the bonding between tungsten and tungsten particles as well as the formation of obvious sintering necks.

关 键 词：W-Cu材料 熔渗 粒径配比 性能 

分 类 号：TG146.2[一般工业技术—材料科学与工程]