液晶玻璃基板激光切割数值模拟与实验  

Numerical Simulation and Experiment of Laser Cutting Liquid Crystal Display Glass Substrates

作　　者：汪旭煌[1,2,3] 姚建华[1,2] 周国斌[1] 楼程华[1,2] 

机构地区：[1]浙江工业大学特种装备制造与先进加工技术教育部/浙江省重点实验室,浙江杭州310014 [2]浙江工业大学激光加工技术工程研究中心,浙江杭州310014 [3]浙江工业大学理学院,浙江杭州310014

出　　处：《中国激光》2011年第6期95-99,共5页Chinese Journal of Lasers

基　　金：浙江省科技厅(2009C31104)资助课题

摘　　要：激光切割液晶玻璃基板是一个复杂的光致热过程,在整个切割过程中温度起着至关重要的作用。运用可控断裂激光切割技术断裂液晶玻璃基板,热应力用于诱导裂纹并使材料沿着切割路径扩展开裂。为了给实际激光热应力切割以指导,减少切割过程中的盲目性,提高激光热应力切割的质量,提出了一种激光切割液晶玻璃基板的数值模拟方法。利用有限元软件ANSYS进行温度场数值计算,建立了激光切割液晶玻璃基板温度场的有限元模型。研究了激光功率和光斑直径对激光切割过程中温度场的影响,得到了温度分布与激光功率、光斑直径的关系。用数值计算结果指导切割,获得了良好的切割效果。Laser cutting of liquid crystal display（LCD） glass substrate is a complex light-induced heat process,in which the temperature plays a vital role.In fracture controlled laser cutting technology,thermal stress is used to induce fissure and break the LCD glass substrate.In order to guide the actual thermal stress laser cutting,as well as reduce the blindness and improve the quality in the cutting process,a numerical simulation is proposed for laser cutting LCD glass substrate.The distribution of temperature is obtained by using finite element analysis software ANSYS.A temperature field numerical simulation is established as laser cutting LCD glass substrate.The effects of laser power and spot diameter on the temperature field are studied and the relationship is obtained.A good cutting profile is obtained in experiment with the help of the numerical simulation results.

关 键 词：激光技术 激光切割 温度场 液晶玻璃基板 数值模拟 

分 类 号：TN249[电子电信—物理电子学]