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机构地区:[1]山东科技大学化学与环境工程学院,山东青岛266510
出 处:《电镀与涂饰》2011年第6期34-37,共4页Electroplating & Finishing
摘 要:以葡萄糖为碳源、污水处理厂厌氧池的活性污泥为种源,处理化学镀镍老化液中的亚磷酸盐和次磷酸盐。通过正交试验考察了葡萄糖添加量、菌种培养温度和初始pH、接种比及培养时间对磷去除率的影响。获得了最佳处理条件:葡萄糖0.8g/L,培养液初始pH为6.5,温度35°C,接种比1.5∶1,培养时间4d。在此条件下处理化学镀镍老化液,亚磷酸盐的去除率可达34.3%,次磷酸盐的去除率为47.8%。The phosphite and hypophosphite in spent electroless nickel plating bath were treated by using glucose as carbon source and the activated sludge from anaerobic pool of a sewage plant as seed source. The effects of the dosage of glucose,cultivation temperature of bacteria and initial pH,inoculation ratio and cultivation time on phosphorus removal were studied by orthogonal test. The optimal conditions were obtained as follows:glucose 0.8 g/L,initial pH of nutrient fluid 6.5,temperature 35 °C,inoculation ratio 1.5:1 and cultivation time 4 d. Under these conditions,the spent electroless nickel plating solution was treated,resulting in a removal rate of 34.3% for phosphite and 47% for hypophosphite.
分 类 号:TQ153.12[化学工程—电化学工业]
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