Al_2O_3/Cu复合镀层的微观结构及其生长模型  

Microstructures and Growing model of Al\-2O\-3/Cu of Composite Coating

作　　者：赵乃勤[1] 王玉林[1] 曲传江[1] 董向红[1] 郑冀[1] 李国俊[1] 

机构地区：[1]天津大学材料学院

出　　处：《金属热处理学报》1999年第3期14-18,共5页

摘　　要：电沉积Ａｌ２Ｏ３／Ｃｕ 复合镀层的光镜及ＳＥＭ 分析结果表明，复合镀层的组织结构受极板放置方式、电流密度和施镀时间的影响；电沉积初期以平面生长和螺旋生长两种方式进行，并以平面生长为主，形成胞状形态；沉积后期转向基体金属的择尤生长，形成脊状生长形态。Microstructures of Al\-2O\-3/Cu composite coating by electrolytic codeposition were studied and its growing model was suggested. The results show that microstructures of the coating was influenced by the position of electrode\|plates,current density and plating time. The coating grew in the way of of plane and spiral,especially by plane. The surface appeared small mound shape at the beginning of plating,then developed a ridge shape.

关 键 词：复合镀层 电沉积 微观结构 生长模型 铜 氧化铝 

分 类 号：TB333[一般工业技术—材料科学与工程] TQ153[化学工程—电化学工业]