基于有限元的热裂法切割液晶玻璃的仿真分析  

Imitating Analysis of Cutting LCD-glass Based on Finite Element Thermal Cracking Method

作　　者：杨渊思[1] 卢炎麟[1] 周国斌[1] 郭聪聪[1] 

机构地区：[1]浙江工业大学特种装备制造与先进加工技术教育部重点实验室,浙江杭州310014

出　　处：《轻工机械》2011年第3期13-17,共5页Light Industry Machinery

基　　金：国家自然科学基金(10972198);国家自然科学基金(50675206);浙江省科技厅的项目(2009C31104)

摘　　要：介绍了激光热裂法,即利用移动热源控制裂纹切割玻璃。运用有限元软件Ansys的参数化设计语言建立二维模型,对激光扫描玻璃模型进行仿真。通过该仿真研究了切割过程中裂纹尖端附近的应力和裂纹尖端的应力强度因子,讨论了激光功率和激光扫描速度两关键加工参数对切割的影响,并给出了裂纹可连续扩展的加工参数范围。仿真结果表明,以裂纹尖端的应力强度因子为参考进行仿真,可以更直观的解释热裂法机理,并可以对实际激光切割液晶玻璃的加工参数进行更准确的预测,从而减少实际切割的盲目性。Laser thermal cracking method is to cut glass by laser-controlled crack with moving heat-source.The two-dimensional model of glass is established by using the finite element software Ansys of parameter-design-language to stimulate glass model scanned by laser.In the stimulation of laser scanned glass,the stress near the crack tip and the stress intensity factor（SIF） during the cutting process were studied,and discussed the influence of two-key processing parameters —laser power and laser scan speed — on cutting,as well as gave out the range of cutting parameters for cracking continuous expanding.The result shows that stimulations based on the SIF can directly explain the mechanism of thermal cracking method and forecast the parameters more accuracy for the cutting process,and therefore lower the blindness of real cuttings.

关 键 词：玻璃加工 热裂法 激光 裂纹 玻璃 应力强度因子 

分 类 号：TQ171.6[化学工程—玻璃工业] O343.6[化学工程—硅酸盐工业]