碳纳米管与外电路的连接技术进展  

Development of the Interconnection Technology Between Carbon Nanotubes and External Circuits

作　　者：赵波[1] 齐红霞[1] 孟跃红[1] 

机构地区：[1]徐州师范大学物理与电子工程学院,江苏徐州221116

出　　处：《微纳电子技术》2011年第6期403-410,共8页Micronanoelectronic Technology

基　　金：徐州师范大学科研基金资助项目(10XLS03;10XLA04);徐州市科技计划项目(XZZD1001)

摘　　要：首先,介绍了碳纳米管电子器件应用中的关键工艺技术——碳纳米管与外电路的连接技术,回顾了碳纳米管与外电路装配的发展历程。从碳纳米管在电极间的随机连接到电场定位组装和原子力显微镜的可控操纵,描述了各种装配方法的特点。其次,讨论了碳纳米管与外电路连接的可靠性问题,并介绍了电子束、扫描探针显微镜和超声波等多种改善接触性能的焊接方法。最后,简单展望了碳纳米管与外电路连接的发展趋势,指出数目可控的碳纳米管组装技术和规模化的焊接工艺是今后研究工作的重点。The interconnection methods between carbon nanotubes（CNTs）and external circuits are introduced firstly,which are key technologies in the applications of CNT electron devices.The development history of the assembly for CNTs and external circuits is reviewed.The characteristics of CNT assembly methods are described from the stochastic bridge between the electrodes of CNTs to the controlled operation of the orientation assembly using electric field and the atomic force microscopy.Then,the reliability of the interconnection between CNTs and external circuits is discussed.In addition,some welding methods to improve the contact properties between CNTs and external circuits are reviewed,such as the electron beam,scanning probe microscope and ultrasonic wave.Finally,the development tendency of the interconnection between CNTs and external circuits is prospected.It is pointed out that the number controlled CNT assembly and large-scale welding process are the research emphasis in the future.

关 键 词：碳纳米管(CNT) 纳电子器件 组装 连接 可靠性 

分 类 号：TB383[一般工业技术—材料科学与工程]