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作 者:Ving Yang Shengsheng Zhao Jun Gong Xin Jiang Chao Sun
机构地区:[1]State Key Laboratory of Corrosion and Protection, Institute of Metal Research, Chinese Academy of Sciences,Shenyang 110016, China [2]Instituteof Materials Engineering, University of Siegen, Paul-Bonatz-Str. 9-11, Siegen 57076, Germany
出 处:《Journal of Materials Science & Technology》2011年第5期385-392,共8页材料科学技术(英文版)
基 金:supported by the National Natural Science Foundation of China under Grant No. 50471072
摘 要:(Ti,AI)N films were fabricated by arc ion plating (ALP) and then annealed within a range of temperatures from 200 to 500℃ for 30 rain in vacuum. The results indicate that the average residual stresses decrease slightly from -5.84 to -4.98 GPa with increasing annealing temperature. The stress depth distribution evolves from a sharp "bell" shape to a mild "bell" shape, suggesting a more uniform stress state in the annealed films. The microstructure of the films was also investigated in detail. The as-deposited film consists of fine columnar crystals with an amorphous phase at the interface. During heat treatment, the columnar subgrain growth was observed; meanwhile, the phenomenon of crystallization has been identified at the interface. Further more, the relationship between the residual stresses and the microstructure of the films was explored and highlighted. In addition, there is no hardness degradation of the films during heat treatment.(Ti,AI)N films were fabricated by arc ion plating (ALP) and then annealed within a range of temperatures from 200 to 500℃ for 30 rain in vacuum. The results indicate that the average residual stresses decrease slightly from -5.84 to -4.98 GPa with increasing annealing temperature. The stress depth distribution evolves from a sharp "bell" shape to a mild "bell" shape, suggesting a more uniform stress state in the annealed films. The microstructure of the films was also investigated in detail. The as-deposited film consists of fine columnar crystals with an amorphous phase at the interface. During heat treatment, the columnar subgrain growth was observed; meanwhile, the phenomenon of crystallization has been identified at the interface. Further more, the relationship between the residual stresses and the microstructure of the films was explored and highlighted. In addition, there is no hardness degradation of the films during heat treatment.
关 键 词:Arc ion plating Heat treatment MICROSTRUCTURE Stress distribution (Ti AI)N
分 类 号:TG404[金属学及工艺—焊接] X799.305[环境科学与工程—环境工程]
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