三类超宽带芯片设计方案的比较分析  

Comparative analysis on three ultra wideband chip design methods

作　　者：赵亮[1] 金梁[1] 季中恒[1] 陈金玉[1] 刘双平[1] 

机构地区：[1]国家数字交换系统工程技术研究中心,郑州450002

出　　处：《计算机应用》2011年第7期1971-1975,共5页journal of Computer Applications

基　　金：国家863计划项目(2009AA0112022009AA011205);国家科技重大专项(2009ZX03006-007)

摘　　要：根据使用的载波方式,现有的超宽带芯片设计方案可具体划分为无载波超宽带、单载波超宽带和多载波超宽带三类。这三类芯片设计方案虽然都比较成熟,但由于均存在一些技术难点,所以目前并未有一种方案取得绝对优势并得到广泛应用。通过对相关技术和芯片设计实例的研究,从系统复杂度、峰均功率比、系统总功耗、抗频率选择性衰落、载波同步、码元同步和扩频增益这七个方面对三类超宽带芯片设计方案进行了比较分析,为不同应用场景下芯片设计方案的选型提供了参考。At present,in consideration of the carrier mode,the chip design methods of ultra wideband systems mainly involve no-carrier ultra wideband,single carrier ultra wideband and multi-carrier ultra wideband.Although the three chip design methods are relatively mature,there still exist some technical difficulties,and none of them have achieved absolute advantage or extensive application.Through the researches on the related technologies and chip design examples,a comparative analysis was made on the three ultra wideband chip design methods in terms of system complexity,peak to average power ratio,overall system power consumption,frequency selective fading resistance,carrier synchronization,symbol synchronization,and spreading gain.The conclusions may provide some useful reference for the selection of ultra wideband chip design methods in different application scenarios.

关 键 词：超宽带 芯片设计 无载波 单载波 多载波 

分 类 号：TP393[自动化与计算机技术—计算机应用技术] TN914[自动化与计算机技术—计算机科学与技术]