硫酸盐还原菌生物膜下铜镍锡合金的腐蚀行为  

CORROSION BEHAVIOR OF Cu-Ni-Sn ALLOY UNDER SULFATE-REDUCING BACTERIA BIOFILM

作　　者：陈娟[1] 类延华[1] 高冠慧[1] 孔茉莉[1] 尹衍升 

机构地区：[1]中国海洋大学材料科学与工程研究院,青岛266100 [2]上海海事大学海洋材料科学与工程研究院,上海201306

出　　处：《中国腐蚀与防护学报》2011年第3期231-235,共5页Journal of Chinese Society For Corrosion and Protection

摘　　要：用开路电位法、极化曲线法和电化学阻抗技术研究硫酸盐还原菌(SRB)对铜镍锡合金腐蚀行为的影响。用扫描电镜(SEM)和能谱分析(EDS)观察铜镍锡合金的腐蚀形貌。结果表明,SRB的存在使电极开路电位从-275mV负移至-750mV,较无菌环境中开路电位(-100mV)下降了650mV,合金腐蚀加速。扫描电镜观察结果表明,合金表面生成不均匀的生物膜,主要发生点蚀和缝隙腐蚀。能谱分析显示腐蚀产物主要是铜和镍的硫化物,生物膜下铜镍锡合金发生脱镍和脱锡腐蚀。The effect of sulfate - reducing bacteria （SRB） on corrosion behavior of Cu-Ni-Sn alloy were studied using open circuit potential, polarization curve and electrochemical impedance spectroscopy （EIS） methods. Scanning electron microscopy （SEM） and energy dispersive spectrometer （EDS） were utilized to investigate the corrosion morphologies of Cu-Ni-Sn alloy. The open circuit potential of the alloy in condition with SRB decreased from -275 mV to -750 mV and nearly 650 mV lower than that of which without SRB （-100 mV）. SEM results showed that an uneven biofilm occurred on the alloy surface and there were pitting corrosion and crevice corrosion. EDS analysis indicates that denickelification and detinning corrosion occurred and the corrosion products were copper and nickel sulfide. Therefore, the corrosion of Cu-Ni-Sn alloy accelerated under the biofilm of SRB.

关 键 词：铜镍锡合金 SRB生物膜 微生物腐蚀 脱镍腐蚀 

分 类 号：TG172[金属学及工艺—金属表面处理]