树脂结合剂含量对单晶硅片减薄加工用砂轮性能的影响规律研究  

Research on Influence of Wheel Performance on Silicon Wafer Thinning by Resin Bond Content

作　　者：叶恒[1] 魏昕[1] 陈卓[1] 谢小柱[1] 

机构地区：[1]广东工业大学

出　　处：《工具技术》2011年第5期17-20,共4页Tool Engineering

基　　金：国家自然科学基金资助项目(U0734008);广东省自然科学基金资助项目(10151009001000036)

摘　　要：通过磨削实验,研究了树脂结合剂含量对用于单晶硅片减薄加工的金刚石砂轮的力学特性和磨削性能的影响,对砂轮的硬度、抗压强度、气孔率、磨削比、堵塞现象等进行了对比分析。结果表明,随着树脂结合剂含量增加,砂轮的硬度、抗压强度逐渐增大,气孔率变化不大。在单晶硅片的磨削实验中,随着树脂结合剂含量增加,砂轮的磨削比逐渐增大;树脂结合剂含量高的砂轮,表面更容易堵塞。The influences of resin bond content on the mechanical properties and grinding performances of diamond grinding wheel for the thinning machining of silicon wafers were studied through grinding experiment.The wheel hardness,compressive strength,porosity,grinding ratio and blockage on grinding wheel surface were compared and analyzed.The results show that with the resin bond content increasing,the wheel hardness and compressive strength increased,and the porosity had little changed.In the grinding experiment for silicon wafers,the grinding ratio increased when the resin bond content increased;the grinding wheel with higher resin bond content tend to block on surface more easily.

关 键 词：树脂结合剂含量 金刚石砂轮 硬度 磨削比 砂轮堵塞 

分 类 号：TG743[金属学及工艺—刀具与模具]