环氧片状模塑料用微胶囊固化剂的制备  

Preparation of microcapsule curing agent for epoxy sheet molding compound

作　　者：李建[1] 黄志雄[2] 孙忠登[2] 

机构地区：[1]湖北汽车工业学院材料工程系,湖北十堰442002 [2]武汉理工大学材料科学与工程学院,湖北武汉430070

出　　处：《粘接》2011年第6期51-55,共5页Adhesion

摘　　要：以2-乙基-4-甲基咪唑(2E4MI)为芯材、聚乙二醇(PEG-6000)为壁材,采用熔融喷雾法制备了一种环氧片状模塑料用微胶囊固化剂。对微胶囊进行了表征,对环氧树脂的固化行为进行了研究。研究表明,该胶囊固化剂中囊芯材料2E4MI的质量分数约为l3.7%。ESMC的最佳固化工艺确定为:101℃/10min+111℃/10min+150℃/10min+180℃/10min。微胶囊化固化剂中的PEG-6000壁膜在常温下可以阻止环氧树脂的固化,使ESMC树脂糊体系具有更好的室温贮存稳定性。固化剂的微胶囊化不会引起固化机理的变化。环氧树脂的固化度α可达0.93。Using 2-methyl-1-methyl imidazol （2E4MI） as the core and polyethylene glycol （PEG-6000） as the wall material the microcapsule curing agent for epoxy sheet molding compound was prepared by melting spraying method.The characterization of microcapsule and its curing behavior were carefully studied.Results showed that the weight content of 2E4MI in the capsule was about 13.7%.And the optimum curing process was as follows：101℃/10min＋111℃/10min＋150℃/10min＋180℃/10min.The PEG-6000 in the capsule can prevent curing of epoxy resin at room temperature, which made the resin paste system of ESMC have a long storing time at room temperature.This kind of microencapsulated curing agent did not cause any changes of curing mechanism and the curing degree of ESMC with the microcapsule curing agent can be up to 0.93.

关 键 词：环氧片状模塑料(ESMC) 模压 中温快速固化 微胶囊固化剂(mc) 

分 类 号：TQ433.437[化学工程] TQ314.256