CE/EP/A复合体系的固化及膜性能  

Cure of CE/EP/A System and Properties of the Film

作　　者：吴石山[1] 胡柏星[1] 陈强[1] 沈健[1,2] 

机构地区：[1]南京大学化学化工学院高分子科学与工程系,江苏南京210093 [2]南京师范大学化学和环境学院,江苏南京210097

出　　处：《高分子材料科学与工程》2011年第6期88-90,94,共4页Polymer Materials Science & Engineering

摘　　要：研究了环氧树脂/丁腈橡胶(EP/A)并用体系和二月桂酸二丁基锡(B)对氰酸酯树脂(CE)的固化以及CE/EP/A膜性能的影响。室温下停放30 d的CE/EP/A/B体系能有效固化。A用量从20%提高到24%,CE/EP/A/B(95-x/5/x/0.14)体系固化温度从163.9℃下降到152.2℃;B用量从0.14%增加到0.3%,CE/EP/A/B(75/5/20/y)体系固化温度从163.9℃下降到148.9℃。A用量从20%增加到25%,CE/EP/A/B(95-x/5/x/0.06)膜冲击强度和柔韧性分别从43kg·cm和15 mm提高到50 kg·cm和10 mm,热分解温度从394.4℃下降到377.2℃;B用量增加,CE/EP/A/B膜冲击强度和柔韧性下降,热稳定性提高。Effects of epoxy resin/chemigum （EP/A） system and dibutyltion dilaurate （B） on cure of cyanate ester resins （CE） and properties of CE/EP/A film were studied. The CE/EP/A/B system deposited for 30 days at room temperature could be cured. When the A content increases from 20% to 24%, the curing temperature of CE/EP/A （95-x/5/x/0.14） system decreases form 163.9 ℃ to 152.2 ℃; when the B content increases form 0.14% to 0.3%, the curing temperature of CE/EP/A/B （75/5/20/y） system decreases form 163.9 ℃ to 148.9℃. When the A content increases from 20% to 25%, the impact strength and flexility of CE/EP/A/B （95-x/5/x/0.06） film increases from 43 kg＇cm and 15 mm to 50 kg· cm and 10 rnm, while the thermal decomposition temperature decreases from 394.4 ℃to 377.2 ℃ ; with increasing the B content, the impact strength and flexility of CE/EP/A/ B film decreases, while its thermal stability increases.

关 键 词：氰酸酯树脂/环氧树脂/丁腈橡胶体系 存放 固化 性能 

分 类 号：TB383[一般工业技术—材料科学与工程]