铜粉处理酸性镀铜溶液中氯离子的机理  

Mechanism of Treating Chloride Ion in Acidic Copper Plating Bath with Copper Powder

作　　者：郭崇武[1] 

机构地区：[1]广州超邦化工有限公司,广东广州510460

出　　处：《电镀与精饰》2011年第6期20-22,共3页Plating & Finishing

摘　　要：阐明了用铜粉处理酸性镀铜溶液中氯离子的机理,理论分析和实验表明,在酸性镀铜溶液中,Cu2+离子与铜粉反应生成Cu+离子,同时氯离子与Cu+离子反应生成氯化亚铜沉淀。向镀液中加铜粉1 g/L,氯离子的起始质量浓度为174 mg/L时,氯离子的去除率为58.9%,而向镀液中加锌粉1 g/L,氯离子的去除率为47.0%,用铜粉处理氯离子的效率较高。The mechanism of treating chloride ion in acidic copper plating bath by using copper powder was illustrated.Theoretical analyses and experimental tests indicated that in acidic copper plating solution Cu2＋ ion could react with copper powder to form Cu＋ ion and the Cu＋ ion could react with chloride ion in the solution to produce cuprous chloride precipitation.When the initial mass concentration of the chloride ions in the acidic copper plating solution was 174 mg/L,the elimination rate of chloride ions after adding 1 g/L copper powders to the solution was 58.9% while that after adding 1 g/L zinc powders was 47.0%.This indicates that the treatment efficiency of chloride ion in the acidic copper plating solution with copper powders is higher than that with zinc powders.

关 键 词：酸性镀铜 氯离子 铜粉 处理机理 

分 类 号：TQ153.14[化学工程—电化学工业]