高热导率氮化铝陶瓷研究进展  

Research Progress of Alumina Nitride Ceramics with High Thermal Conductivity

作　　者：燕东明[1] 高晓菊[1] 刘国玺[1] 常永威[1] 乔光利[1] 牟晓明[1] 赵斌[1] 

机构地区：[1]中国兵器工业第五二研究所,烟台264003

出　　处：《硅酸盐通报》2011年第3期602-607,共6页Bulletin of the Chinese Ceramic Society

基　　金：国际科技合作项目(2008DFR50390)

摘　　要：氮化铝(AlN)陶瓷具有热导率高、热膨胀系数低、电阻率高等特性以及良好的力学性能,被认为是新一代高性能陶瓷基片和封装的首选材料。本文简要介绍了氮化铝陶瓷的基本特性,重点总结了氮化铝陶瓷的国内外研究现状及其制备工艺,并列举了一些氮化铝陶瓷的应用实例。Aluminum nitride （AIN） has been considered the preferred materials as a new generation of high-performance ceramic substrate and packaging materials due to its remarkable properties, including high thermal conductivity, low thermal expansion coefficient, high electrical resistivity and good mechanic property. In this article, the basic characteristics of aluminum nitride ceramics were introduceed briefly. Its domestic and overseas research status and preparation process were emphatically summarized. The application example of aluminum nitride ceramics in several aspects were listed in the end.

关 键 词：氮化铝 流延成型 注射成型 基片 透明陶瓷 

分 类 号：TQ174[化学工程—陶瓷工业]