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机构地区:[1]南京航空航天大学结构强度研究所,南京210016
出 处:《力学季刊》2011年第2期153-158,共6页Chinese Quarterly of Mechanics
基 金:航空科学基金(20080252)资助项目
摘 要:本文在粘塑性Anand本构方程中引入各向同性损伤变量,建立了基于Anand本构的损伤模型;使用通用有限元分析软件ABAQUS的用户子程序接口UMAT,编写了该损伤模型用户子程序,并将其接入ABAQUS。经过单元级的数值计算,验证了所建立的损伤模型及其相关的用户子程序。结果表明基于Anand本构的损伤模型可以正确表现粘塑性材料的特征,并能反映材料因损伤而出现的刚度退化现象,可供电子封装及其元器件的可靠性评估参考。A damage model was established by introducing an isotropic damage variable to the Anand's viscoplastic constitutive equation. The evolution equation for the damage was determined. This damage model was implemented into finite element software ABAQUS with the form of Fortran code through user subroutines interface UMAT. The model and user subroutine were verified by element level's numerical calculation. The results show that the features of viscoplastic material can be characterized by the damage model, and also the stiffness degradation caused by damage can be reflected. This damage model can be used for reliability evaluating of electronic packaging and its components.
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