电镀添加剂作用机理的发展概况  

Review of Some Mechanisms of Additives in Electroplating

作　　者：舒余德[1] 张昭[1] 唐瑞仁[1] 彭世恒[1] 李劲风[1] 

机构地区：[1]中南工业大学,长沙410083

出　　处：《电镀与环保》1999年第6期5-10,共6页Electroplating & Pollution Control

摘　　要：电镀添加剂对镀层质量起着至关重要作用。它不但可以改变电极反应的过电压，使镀膜晶粒细化，改变晶体取向，而且可以改善镀膜的内应力、延展性、硬度等性能。因此，对电镀添加剂作用机理的了解有助于合成和优选有效的电镀添加剂，提高电镀质量。本文阐述了电镀添加剂的几种常见作用，并试图运用各种机理对其作用进行分析解释。Some mechanisms of additives in electroplating, such as polarizing the cathode, refining the grain of the deposit, changing the orientation of the crystals and improving the internal stress, the ductility and the hardness of the electroplating deposit, are overviewed. Some usual functions of additives are stated, and explained using these mechanisms.

关 键 词：电镀 助剂 镀层 质量 

分 类 号：TQ153[化学工程—电化学工业]