共聚联苯型聚酰亚胺的模压工艺研究  

Molding Process of Copolymerized Biphenyl-polyimide

作　　者：李永真[1] 陈玉红[1] 王贵珍[1] 黄永茂[1] 胡亚伟[1] 

机构地区：[1]河北化工医药职业技术学院,石家庄050026

出　　处：《绝缘材料》2011年第3期57-59,共3页Insulating Materials

基　　金：河北省教育厅2010年度科学研究计划项目(Z2010239)

摘　　要：对联苯四酸二酐、均苯四酸二酐与二氨基二苯醚聚合得到的共聚联苯型聚酰亚胺模塑料的模压成型的主要工艺条件进行了研究,考察了模压温度、模压压力和模压时间对成型制件拉伸性能的影响。采用扫描电子显微镜和热老化实验分别对制件微观形貌和耐热稳定性进行了表征。结果表明:共聚联苯型聚酰亚胺适宜的模压条件为模压温度430℃,模压压力13 MPa,模压时间15 min;制件拉伸断裂面成韧性断裂,且具有优良的热稳定性。The molding process of copolymerized biphenyl-polyimide molding material prepared bycopolymerization of biphenyltetracarboxylic dianhydride,pyromellitic dianhydride and oxydianiline was studied,and the effects of molding pressure,temperature and molding time on the tensile property of the product were investigated.The microstructure and thermal resistance property were characterized by SEM and thermal aging test.The results show that the appropriatemolding conditions are 430 ℃,13 MPa and 15 min respectively.The product of copolymerizedbiphenyl-polyimide show better tensile properties and thermal stability.

关 键 词：共聚联苯型聚酰亚胺 模压工艺 微观形貌 热稳定性 

分 类 号：TM215[一般工业技术—材料科学与工程] TQ323.7[电气工程—电工理论与新技术]