EMC中的两种接地技术  

Case analysis of EMC grounding technology

作　　者：郭亚红[1] 

机构地区：[1]漯河职业技术学院,河南漯河462002

出　　处：《河北工业科技》2011年第4期270-271,274,共3页Hebei Journal of Industrial Science and Technology

摘　　要：电磁兼容接地设计有单点接地和多点接地2种基本方法,低频电路中要求用单点接地,高频电路中用多点接地,用多点接地设备如果不能通过EFT/B测试,可以尝试单点接地方法。实验证明,对某些高频电路完全可以用单点接地方法满足EMC要求。The EMC grounding design consists of single-point grounding and multi-point grounding.Low-frequency circuits require single-point grounding,while multi-point grounding is usually used for equipments of high-frequency circuits.However,when the equipment can not pass the EFT/B test,single-point grounding can be used instead.Experiments prove that some high-frequency circuits can use single-point grounding to meet the EMC requirements.

关 键 词：接地技术 EMC EFT/B 

分 类 号：TM15[电气工程—电工理论与新技术]