C5树脂对SIS/RLPO基热熔压敏胶性能的影响  

Effect of C_5 resin on properties of SIS/RLPO-based HMPSA

作　　者：华丽丽[1] 李杨[1] 赵忠夫[1] 汪晴[2] 胡勇男[2] 

机构地区：[1]大连理工大学化工学院高分子材料与工程系,精细化工国家重点实验室,辽宁大连116024 [2]大连理工大学制药工程学院,辽宁大连116024

出　　处：《中国胶粘剂》2011年第6期27-31,共5页China Adhesives

基　　金：国家自然科学基金项目(51073029);中央高校基本科研业务费资助项目(DUT11LK18);国家“重大新药创制”科技重大专项(2009ZX09502-010)

摘　　要：以SIS/RLPO(苯乙烯-异戊二烯-苯乙烯与丙烯酸乙酯-甲基丙烯酸甲酯-甲基丙烯酸氯化三甲胺基乙酯)共混物作为HMPSA(热熔压敏胶)的基体树脂,考察了C5树脂对基体树脂的相容性及其HMPSA黏附性能的影响。结果表明:随着C5树脂用量的不断增加,PS(聚苯乙烯)相的Tg(玻璃化转变温度)基本不变,PI(聚异戊二烯)相的Tg逐渐趋近于C5树脂的Tg,说明C5树脂与PI相具有较好的相容性,而与PS相的相容性相对较差;当SIS/C5/RLPO共混物中三者质量比为30∶50∶60时,相应HMPSA具有适宜的黏附性能,同时其双连续相结构有利于亲水性药物的释放。With SIS/RLPO（styrene-isoprene-styrene and ethyl acrylate-methyl methacrylate-trimethylamino ethyl methacrylate chloride） compound as matrix resin of HMPSA（hot melt pressure-sensitive adhesive）,the influences of C5 resin on HMPSA＇s adhesion properties and compatibility between matrix resin and C5 resin were investigated.The results showed that the compatibility between C5 resin and PI（polyisoprene） phase was better,but the compatibility between C5 resin and PS（polystyrene） phase was relatively poorer because the Tg（glass transition temperature） of PS phase was basically unchanged,but the Tg between PI phase and C5 resin was gradually approached with increasing C5 resin contents.The SIS/RLPO-based HMPSA had the suitable adhesion properties,and their bicontinuous phase structure was propitious to releasing hydrophilic drugs when the mass ratio of m（SIS）∶m（C5）∶m（RLPO） was 30∶50∶60 in compound.

关 键 词：热熔压敏胶 C5树脂 相容性 黏附性能 

分 类 号：TQ436.3[化学工程] TQ436.4