聚酰亚胺胶粘剂改性技术研究进展  

Research progress of modified technology for polyimide adhesive

作　　者：吴寅[1] Ali Nazakat 张秋禹[1] 程博[1] 

机构地区：[1]西北工业大学理学院应用化学系,陕西西安710129

出　　处：《中国胶粘剂》2011年第6期55-59,共5页China Adhesives

摘　　要：介绍了近年来聚酰亚胺(PI)胶粘剂的常见改性方法。重点分析和总结了PI胶膜表面化学改性方法(包括等离子体改性、离子束改性、化学试剂改性和表面接枝聚合改性等)和PI胶粘剂材料化学改性方法,并对PI胶粘剂改性技术的未来发展趋势进行了展望。The recent common modification methods of polyimide（PI） adhesives were introduced.The some surface chemical modification methods（including plasma modification,ion beam modification,chemical reagent modification,and surface graft modification） of PI films and material chemical modification methods of PI adhesives were emphatically analysed and summarized.And the future development trend of modification technology for PI adhesive was expected.

关 键 词：聚酰亚胺 胶粘剂 改性 

分 类 号：TQ433.439[化学工程] TQ323.7