基于热裂法的液晶玻璃基板激光切割技术研究  

Research of the technology of laser cutting LCD glass substrates based on thermal cracking method

作　　者：汪旭煌[1,2,3] 姚建华[1,2] 周国斌[1] 楼程华[1,2] 杨渊思[1] 

机构地区：[1]浙江工业大学特种装备制造与先进加工技术教育部／浙江省重点实验室,杭州310014 [2]浙江工业大学激光加工技术工程研究中心,杭州310014 [3]浙江工业大学理学院,杭州310014

出　　处：《激光技术》2011年第4期472-476,共5页Laser Technology

基　　金：浙江省科技厅资助项目(2009C31104)

摘　　要：为了实现液晶玻璃基板的可控断裂切割,提出了一种液晶玻璃基板激光切割的新方法。采用Nd:YAG激光在液晶玻璃基板上预置初始裂纹,用CO_2激光作为热源对其进行加热,并用Ar气进行冷却。分析了激光光斑尺寸和液晶玻璃基板厚度对切割的影响,并与传统机械切割进行了对比。用扫描电子显微镜检测了激光切割后切割表面及断面形貌。结果表明,运用机械切割,其基体内存在大量的微裂纹,而基于热裂法的液晶玻璃基板激光切割表面光滑平直、无毛刺、基体内无微裂纹存在,切割断面影响区小于20μm,优越性明显高于机械切割。In order to cut liquid crystal display （LCD） glass substrates with controlled crack, a new method was put forward. Firstly, an initial crack was prepared on the surface of LCD substrates with Nd： YAG laser. Then, the substrate was heated up with CO2 laser and cooled with Ar gas. The effect of laser spot size and the thickness of LCD glass substrates on laser cutting quality was analyzed. The surface and performance of the cutting face after laser treatment was tested by means of scanning electronic microscope （SEM）. The cutting quality was compared with the traditional mechanical cutting quality. The results show that there are lots of micro cracks in the substrates cut with traditional mechanical method, however, the laser cutting surface based on thermal cracking method is smooth and flat, no micro cracks exists, and the cutting section-affecting zone is less than 201xm. It is better to cut LCD glass substrates with thermal crack laser cutting method than mechanical cutting method.

关 键 词：激光技术 激光切割 裂纹控制法 液晶玻璃基板 裂纹扩展 

分 类 号：TG485[金属学及工艺—焊接]