工艺因素对脉冲电沉积Ni-P合金镀层组织及性能的影响  

Effect of the process factors on microstructure and property of pulse electroplated Ni-P alloy coatings

作　　者：朱玲玲[1] 彭成章[1] 张晓菲[1] 

机构地区：[1]湖南科技大学机电工程学院,湖南湘潭411201

出　　处：《湖南科技大学学报（自然科学版）》2011年第2期27-30,共4页Journal of Hunan University of Science And Technology：Natural Science Edition

基　　金：国家自然科学基金资助项目(50764004);湖南省科技计划项目(2010FJ3093);湖南科技大学研究生创新基金资助(S100111)

摘　　要：采用脉冲电沉积方法在Q235钢表面制备Ni-P合金镀层.通过扫描电镜(SEM)观察、显微硬度测试和沉积速率计算,探讨了脉冲频率、镀液温度和占空比等工艺因素对Ni-P合金镀层组织和性能的影响.结果表明:在脉冲频率1 500 Hz、占空比0.2和镀液温度50℃的工艺条件下,可以获得沉积速率较快、显微硬度较高和组织细小均匀的高磷非晶态Ni-P合金镀层.Ni-P alloy coatings were prepared on the surface of Q235 steel by pulse eletroplating,the effect of process factors was discussed by observation of SEM,testing of microhardness and deposition rate,such as pulse frequency,duty cycle and plating temperature etc.,to microstructure and performance of the Ni-P alloy coatings.The results show that high phosphorus amorphous Ni-P alloy coatings with faster deposition rate,higher microhardness and finer uniform tissue is obtained under condition of pulse frequency 1 500 Hz,duty cycle 0.2 and plating temperature 50 ℃.

关 键 词：脉冲电沉积 NI-P合金镀层 工艺因素 显微硬度 

分 类 号：TQ153.2[化学工程—电化学工业]