膏剂渗硼及其研究现状  

Paste Boriding and Its Research Status

作　　者：刘建建[1] 陈祝平[1] 

机构地区：[1]集美大学机械工程学院,福建厦门361021

出　　处：《电镀与精饰》2011年第7期24-28,共5页Plating & Finishing

摘　　要：介绍了膏状渗硼剂的主要化学成分、膏剂渗硼的机理过程及相关化学反应、膏剂渗硼的工艺参数及目前膏剂渗硼工艺方法研究的状况,并简要介绍了渗硼层的组织形态、耐腐蚀和耐磨损性能。同时,对今后膏剂渗硼的研究方向做出了展望。The main component,boronization mechanism and chemical reactions of paste boriding were reviewed,and the present research of boriding methods and parameters were introduced.Meanwhile morphology,microstructure and corrosion and wear resistances of boriding layer were briefly discussed.Finally,the research tendency and prospect of paste boriding were put forward.

关 键 词：膏剂渗硼 成分 工艺 性能 

分 类 号：TG174.445[金属学及工艺—金属表面处理]