激光喷射钎料球键合焊点热循环试验研究  

Thermal shock test of solder joint obtained by laser jet solder ball bonding method

作　　者：王晓林[1] 李明雨[1] 王春青[2] 

机构地区：[1]哈尔滨工业大学深圳研究生院材料科学与工程学院,深圳518055 [2]哈尔滨工业大学现代焊接生产技术国家重点试验室,哈尔滨150001

出　　处：《材料科学与工艺》2011年第3期88-92,共5页Materials Science and Technology

基　　金：国家高技术研究发展计划资助项目(2007AA04Z343)

摘　　要：为研究激光喷射钎料球键合焊点的可靠性,用Sn3.0Ag0.5Cu钎料球对Au/Cu焊盘进行了激光喷射钎料键合试验,采用微强度测试仪、扫描电子显微镜、能谱分析仪研究了热循环条件对接头强度以及界面微观组织演变的影响.结果表明:采用激光喷射钎料键合技术焊盘表面Au层不能完全溶入钎料中,导致在界面处形成AuSn2+AuSn4多层金属间化合物结构;热循环处理可导致界面残余的Au层消失,并在原位附近形成以Au、Sn为主并固溶少Cu原子的反应层,引起整个反应层与Cu层的结合力下降.To investigate the reliability of solder joint by laser jet solder ball bonding method,Au/Cu soldering pads were bonded with Sn3.0Ag0.5Cu solder ball.The joint strength was tested by micro-strength tester,the interfacial microstructures were analyzed using SEM and EDX,and the influences of thermal shock treatment on the evolution of interfacial microstructure and joint strength were investigated as well.Results show that the Au finish cannot completely dissolve into solder during the process of solder jet ball bonding,which leads to the formation of multilayer structure of AuSn2＋AuSn4.After thermal shock treatment,the residual Au layer vanishes and（Au,Sn,Cu） reactive layer forms,which leads to the reduction of joint strength.

关 键 词：激光喷射钎料键合 SnAgCu钎料 热循环试验 铜焊盘 

分 类 号：TG454[金属学及工艺—焊接]