CuNiTiB急冷钎料对Si_3N_4陶瓷的连接  

Joining of Si_3N_4 to Si_3N_4 using rapidly solidified Cu (5～25)Ni (16～28)Ti B brazing filler foils

作　　者：熊华平[1] 

机构地区：[1]北京航空材料研究院焊接研究室,北京100095

出　　处：《中国有色金属学报》1999年第4期764-768,共5页The Chinese Journal of Nonferrous Metals

摘　　要：经过急冷处理的Ｃｕ（５ ～２５）Ｎｉ（１６ ～２８） ＴｉＢ 钎料的组织比未经急冷处理的钎料更加均匀，有利于提高Ｓｉ３Ｎ４／Ｓｉ３Ｎ４ 接头的强度。当选用的钎料层厚度为４０ μｍ 和８０ μｍ 时， 接头的三点弯曲强度值分别达到４０２ ＭＰａ 和３８０ ＭＰａ 。分析了接头中元素Ｃｕ ， Ｎｉ， Ｔｉ 的面分布。钎料层厚度大小影响接头的强度， 对其原因进行了探讨。The rapidly solidification treatment makes the microstructure of the Cu (5～25)Ni (16～28)Ti B brazing filler metal more homogeneous. When using the brazing foils with suitable thicknesses of 40 μm and 80 μm, the three point bend strength of the joints shows the high value of 402 MPa and 380 MPa respectively. The element area distribution of Cu, Ni and Ti of the joint was examined. The joint strength varies with the thickness change of the brazing foils, and the causes were studied.

关 键 词：钎焊 接头强度 急冷钎料 陶瓷 

分 类 号：TQ174.627[化学工程—陶瓷工业]