POSS/CE杂化复合材料的制备与介电性能研究  

Study on preparation and dielectric properties of POSS/CE hybrid composite

作　　者：牛磊[1] 颜红侠[1] 唐玉生[1] 朱光明[1] 

机构地区：[1]西北工业大学理学院应用化学系,陕西西安710129

出　　处：《中国胶粘剂》2011年第7期16-19,共4页China Adhesives

基　　金：西安市科技计划项目(YF07005);西北工业大学基础研究基金项目(JC201047)

摘　　要：为制备介电常数(ε)低、介电损耗因子(tanδ)小的集成电路板用树脂基体,以笼型倍半硅氧烷(POSS)对双酚A型氰酸酯(CE)树脂进行改性,制备出一种POSS/CE无机-有机杂化复合材料。着重探讨了POSS用量和后处理工艺等对POSS/CE树脂体系介电性能的影响。结果表明:当w(POSS)=2%(相对于CE单体质量而言)、后处理工艺为240℃/3 h时,改性体系的介电性能相对最好,其测试频率为60 MHz时的ε(为2.9)和tanδ(为0.004 5)分别比纯CE树脂降低了9.4%和35.7%;该改性体系的表观活化能为51.9 kJ/mol。In order to manufacture matrix resin with lower dielectric constant（ε） and smaller dielectric loss factor（tan δ） for integrated circuit breadboard,an inorganic-organic hybrid composite based on POSS（polyhedral oligomeric silsesquioxane）/CE（bisphenol-A cyanate ester） was prepared with POSS as modifier of CE resin.The influences of POSS contents and post-treatment technology on dielectric properties of POSS/CE resin system were emphatically discussed.The results showed that the dielectric properties of modified system were reversely best when mass fraction of POSS was 2% in CE monomer,post-treatment temperature and time were 240 ℃ and 3 h respectively.The ε（2.9） and tan δ（0.004 5） of modified system were 9.4% and 35.7% respectively lower than those of pure CE resin when testing frequency was 60 MHz.The apparent activation energy of modified system was 51.9 kJ/mol.

关 键 词：氰酸酯 笼型倍半硅氧烷 介电常数 介电损耗因子 

分 类 号：TQ323.9[化学工程—合成树脂塑料工业] TQ437.6