微螺旋碳纤维/高密度聚乙烯复合材料电渗流行为及机制  

Electrical percolation behavior and its mechanism of CMCs/HDPE composite

作　　者：蒋迪波[1] 殷明志[1] 彭焕英[1] 

机构地区：[1]西北工业大学理学院应用化学系,陕西西安710072

出　　处：《中国胶粘剂》2011年第7期20-23,共4页China Adhesives

摘　　要：以微螺旋碳纤维(CMCs)作为复合材料的导电填料,以高密度聚乙烯(HDPE)作为复合材料的基体树脂,研究了CMCs/HDPE基复合材料的电渗流行为、渗流阈值附近复合材料的导电机制。结果表明:CMCs/HDPE复合材料存在明显的渗流行为,其渗流阈值为6.28%(CMCs的体积分数)或9.77%(CMCs的质量分数);当CMCs的体积分数接近于渗流阈值时,CMCs/HDPE复合材料的导电方式由隧道效应所致。With carbon microcoiled nano-fibre（CMCs） as conductive filler of composite,high-density polyethylene（HDPE） as matrix resin of composite,the electroosmosis flow behavior of CMCs/HDPE composite and conduction mechanism of composite about the percolation threshold were investigated.The results showed that the CMCs/HDPE composite had obvious electroosmosis flow behavior,and its percolation threshold was 6.28%（volume fraction of CMCs） or 9.77%（mass fraction of CMCs）.The conduction mode of CMCs/HDPE composite was caused by the tunnel effect when volume fraction of CMCs was close to percolation threshold.

关 键 词：微螺旋碳纤维 高密度聚乙烯 渗流阈值 复合材料 导电机制 

分 类 号：TQ325.12[化学工程—合成树脂塑料工业]