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作 者:李新跃[1] 曾宪光[1] 郑兴文[1] 曹盛[1]
机构地区:[1]四川理工学院材料与化学工程学院,四川自贡643000
出 处:《电镀与环保》2011年第4期21-24,共4页Electroplating & Pollution Control
摘 要:以低碳钢为基体进行酸性化学镀Ni-P,采用单因素实验法研究了温度、pH值、还原剂的质量浓度以及时间等工艺参数对化学镀层沉积速率及耐蚀性的影响。结果表明最佳工艺条件为:硫酸镍30 g/L,次磷酸钠40 g/L,柠檬酸钠10 g/L,醋酸10 mL/L,乳酸10 mL/L,pH值4.0,80℃,1.5 h;在该工艺条件下,镀速达78 g.m-2.h-1,镀层厚度达23μm,镀层具有较强的耐蚀性,孔隙率分布较窄。Acid electroless Ni-P alloy plating was carried on carbon steel substrate and the effects of such processing parameters as temperature,pH value,mass concentration of reducing agent,processing time,etc.on deposition rate and corrosion resistance of the electroless coating was investigated by single factor experiments.The results show that the most optimal conditions are: NiSO4·6H2O 30 g/L,NaH2PO2·H2O 40 g/L,C6H5Na3O7·2H2O 10 g/L,acetic acid 10 mL/L,lactic acid 10 mL/L,pH value 4.0,temperature 90 ℃,processing time 1.5h.Under such processing conditions,plating rate has reached 78 g·m-2·h-1 and plating thickness 23 μm.The coating has a strong corrosion resistance and the porosity distribution is narrower.
分 类 号:TQ153[化学工程—电化学工业]
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