酸性镀铜溶液最高允许温度的理论分析  

Theoretical Analysis of Suitable Temperature Range of Plat- ing Bath for Acidic Copper Electroplating

作　　者：吴双成 

机构地区：[1]兰州胜利机械公司,甘肃皋兰730200

出　　处：《材料保护》2011年第8期12-13,25,共3页Materials Protection

摘　　要：酸性光亮镀铜溶液的性能与温度的关系很大,温度影响着Cu2++Cu=2Cu+的平衡,Cu2+和Cu+析出电位相同时镀液性能最好。根据热力学数据、平衡常数与温度的关系等,从析出电位角度推导出了酸性镀铜溶液最高允许的温度范围。指出从理论上讲,酸性镀铜溶液所允许的温度范围为11.0～40.2℃,实际生产时,酸性镀铜溶液所允许的温度范围控制在16.0～35.0℃之间较为合理,即在理论计算范围的基础上缩小5.0℃左右。The performance of acidic bath for bright copper electroplating is highly dependent on temperature, because temperature has significant effect on the equilibrium of Cu2++ Cu=2Cu+. When Cu2+ and Cu+ have the same deposition potential, the plating bath possesses the optimal performance. Thus the suitable temperature range of the acidic plating bath for bright copper electroplating was theoretically determined based on deposition potential theory while thermodynamic parameters as well as the relationship between equilibrium constant and temperature were taken into account.Resuhs indicate that the theoretical temperature of the plating bath for acidic copper electroplating is ranged in 11.0～40.2℃. In practical production, it is reasonable to set the suitable temperature range of the acidic copper electroplating bath as 16.0～35.0 ℃, while the theoretically determined maximum temperature and minimum temperature are both decreased by about 5.0 ℃.

关 键 词：酸性镀铜 镀液温度 热力学 析出电位 平衡电位 Cu+ CU2+ 平衡常数 

分 类 号：TQ153.14[化学工程—电化学工业]